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Project Overview: We are developing ultra-compact smart glasses with embedded AI capabilities for assistive applications. The current prototype uses an ESP32, but we are now seeking to replace it with a more suitable MCU or SoC that offers better local AI performance, lower power consumption, and improved thermal efficiency. This project involves both component selection and electrical design, culminating in a manufacturable PCB layout optimized for wearable integration. 🎯 Objectives: Component Selectio, Identify and recommend a replacement for ESP32 Prioritize AI-capable MCUs/SoCs with proven use in smart glasses or wearables Must support BLE (Wi-Fi optional), low power modes, and compact packaging Evaluate thermal footprint, power draw, and integration complexity Electrical Design & PCB Layout Design compact, low-power PCB for smart glasses form factor Include selected MCU/SoC, power management, sensor interfaces, BLE/Wi-Fi, and optional camera/audio modules Optimize for thermal dissipation, EMI mitigation, and manufacturability (e.g., connector placement, strain relief, wire routing) Documentation & BOM Provide full schematic, layout files (Altium preferred), and annotated BOM Include sourcing suggestions from UK/EU distributors (Digi-Key, RS, Farnell, etc.) Highlight critical acceptance criteria (e.g., connector mating, sensor compatibility, enclosure fit) 📐 Design Constraints: PCB size: Must fit within temple arm or bridge of glasses (~40mm x 10mm target) Power: Battery-operated, 100 mW active power preferred Heat: Minimal heat generation; passive dissipation only AI: Support for local inference (gesture, voice, obstacle detection) Connectivity: BLE required; Wi-Fi 📎 Deliverables: Recommended MCU/SoC shortlist with pros/cons Final schematic and PCB layout files Annotated BOM with sourcing links Design notes for manufacturability and integration Support with ordering PCB to manufacturer and testing after manufacturing. 👤 Ideal Freelancer: Proven experience in wearable electronics and compact PCB design Familiarity with AI-capable MCUs and low-power SoCs Skilled in Altium Designer or equivalent Understanding of connector-wire integration and strain relief Bonus: Experience with smart glasses, assistive tech, or sensor fusion 📅 Timeline: Initial component selection and schematic: 1–2 weeks PCB layout and documentation: 2–3 weeks If you are interested. Please submit or message via UPwork, please do not get in touch outside Upwork. Please submit, short idea of what how our collaboration might look. Please include your experience and timeline, you can deliver project. This can became long full-time project